| 摘要 |
PROBLEM TO BE SOLVED: To reduce the quantity of dry air to be used for lowering a temperature. SOLUTION: Concerning the heat treatment device for applying a heat treatment to a wafer W, this device is provided with a hot plate 1 for placing the wafer W, heating element 1 for heating the hot plate 1, cooling jacket 5 which has an injection port 7 for injecting a gas for cooling and for cooling the hot plate 1, gas piping 13 for communicating the injection port 7 of the cooling jacket 5 and a cooling gas feeding source 15, and air cooler 20 provided on the gas piping 13 for controlling the temperature of the gas for cooling (dry air), which flows in the gas piping 13. |
