发明名称 Improved car industry electronic power module construction/manufacture having power module first printed circuit board mounted and polymer film adhesive solidly connected second printed circuit board/conductor bar.
摘要 The power module has a power component (3) on a printed circuit board (7). A power conductor (10) feeds a second printed circuit (7), and the second printed circuit board contacts the power component via a contact strip (4). The power conductor and second printed circuit are solidly connected by a polymer adhesive strip (13). The lower conductor and first circuit board are covered by thermal isolating layers (14,15).
申请公布号 FR2802714(A1) 申请公布日期 2001.06.22
申请号 FR19990016160 申请日期 1999.12.21
申请人 SAGEM SA 发明人 PLOIX OLIVIER DOMINIQUE
分类号 H01L25/07;H01L25/18;H05K1/02;H05K3/40;H05K7/20;(IPC1-7):H01R12/18;H05K3/30 主分类号 H01L25/07
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