| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board together with its manufacturing method wherein the high-frequency characteristics of a ground line and power source line are improved to prevent malfunction of an IC chip. SOLUTION: A large-diameter through hole 36B at an outer peripheral part is a signal line. A small-diameter through hole 36A at a central part is a power source line and ground line, thus arraying multiple power source lines and ground lines and shortening the wiring length from an IC chip 90 to a daughter board 94. So, the inductance component of the power source line and ground line to the IC chip is reduced, preventing malfunction of the IC chip.</p> |
