BUILD-UP WIRING BOARD AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a build-up wiring board comprising a wiring excellent in adhesion to an insulator. SOLUTION: An electrode or wiring comprises a base material of a titanium nitride thin-film. The wiring is electrically copper-plated and a build-up insulating layer comprises an epoxy acrylate having fluorene skeleton.