| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer wiring board where an electronic element such as semiconductor element is mounted on a substrate, while occurrence of void is suppressed for improved reliability. SOLUTION: A process where vias 18A and 18B for interlayer connection are formed at insulating substrates 15A and 15B, a process where wiring patterns 17A and 17B are formed at the insulating substrates 15A and 15B, and a process where the insulating substrates 15A and 15B are pasted together by multiple numbers using a film-like adhesion 16B for multilayer, are provided. Here, a through hole 20B is formed at the insulating substrates 15A and 15B before a bonding process. When the film-like adhesive 16B is provided at the insulating substrate 15B, the air in a void 27 occurring between them is discharged outside through the through hole 20B so that the film-like adhesive 16B adheres to the insulating substrate 15B. |
