METHOD AND DEVICE FOR DISPLAYING SOLDER SHAPE AT SOLDERING PART

摘要

PROBLEM TO BE SOLVED: To provide a method and device for displaying solder shape at a soldering part by which a solder shape at an older join part is acquired and displayed without actual solder-jointing. SOLUTION: The solder amount supplied to a soldering part where the electrode of a substrate is jointed to the terminal of an electronic part is acquired with a solder volume calculating part 23. Based on the data of solder amount and dimension of an electrode and terminal acquired with an electrode/mask opening dimension calculating part 22, the 3-dimensional coordinates of a plurality of points representing a surface shape of solder at the soldering part is calculated with a solder 3-dimensional shape calculating part 24, which is processed with a display process unit 21 for displaying the surface shape of solder on a display 11 as an image. Thus, without actual soldering, the 3-dimensional shape of solder is visually confirmed using only a numerical data.