发明名称 PACKAGE FOR STORAGE OF SEMICONDUCTOR COMPONENT
摘要 PROBLEM TO BE SOLVED: To dissolve deterioration in the airtightness caused by the void at the junction between a frame and an insulating terminal member, the shortage of brazing material, or the like, and the marring of the junction reliability by the residual thermal stress among the substrate, the frame, and the terminal member. SOLUTION: A groove 2b is made from the cut 2a of a frame 2 to the topside, and the groove 2b is such that X/5<=Y<=X and that Z/6<=W<=3Z/4, when defined that the width of the cut 2a is W, that the width of the groove 2b is Y, that the thickness of the frame 2 is Z, and that the depth of the groove 2b is W.
申请公布号 JP2001168220(A) 申请公布日期 2001.06.22
申请号 JP19990351488 申请日期 1999.12.10
申请人 KYOCERA CORP 发明人 SATAKE TAKEO;ISHIDA TSUTOMU;AWATANI HISASHI;NODA HIROSHI
分类号 H01L23/02;H01L23/10;H03H9/25;(IPC1-7):H01L23/02 主分类号 H01L23/02
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