| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a wiring pattern whereby the wiring on a substrate can be easily and reliably made and the yield of circuit elements can be improved. SOLUTION: In the wiring pattern forming method using the lift off, a victim layer 41 easily removable from a substrate 2 is formed on the substrate 2, a negative type photo resist layer 42 is laminated on the victim layer 41, this resist layer 42 is exposed through a photo mask 6 masking wiring pattern regions and developed to form a laminate 4 of the victim layer 41 and the negative type photo resist layer 42 on other regions than the wiring pattern regions on the substrate 2, metal films 71, 72 are laminated respectively on the laminate 4 and the substrate 2 on which the laminate 4 is not formed, and the metal film 71 laminated on the laminate 4 is removed together with the laminate 4, thus forming a wiring pattern.
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