| 摘要 |
PROBLEM TO BE SOLVED: To provide small-sized electronic components, the terminal of which has a high strength of adhesion and a high soldering property and a method of manufacturing the parts. SOLUTION: In order to satisfy both the soldering property and strength of adhesion of the terminal of electronic components, only one surface of the terminal is plated and the non-soldered metallic surface of the terminal is fixed to a base material through bonding. Since the metallic surface is fixed directly to the base material by bonding, the strength of adhesion of the terminal can be maintained at a high level. In addition, since the electronic parts uses the terminal, the side face of which is partially wrapped by the plated film which is expanded to part of the side face due to the shear force applied at punching of a metallic sheet, the terminal can be soldered to a substrate due to satisfactory solder wettability of the side face of the terminal, and in addition, the strength of the terminal becomes sufficiently strong, when the parts are welded to the substrate.
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