| 摘要 |
PROBLEM TO BE SOLVED: To provide an ion injection system that equalizes characteristics within the surface of a wafer 20, in an ion injection system provided with an ion injection device and injected characteristic measuring part. SOLUTION: The ion injection system feeds back an injected wafer characteristic data, extracts an area having deterioration tendency within the surface of a wafer 20, compensates a driving speed by an up and down mechanical driving speed controller 17 corresponding to the area and transmits to an ion injection part 2, and drives ion beam 12 to the area having deterioration tendency by changing the driving speed.
|
