| 摘要 |
PROBLEM TO BE SOLVED: To safely and efficiently replace micro chip parts mounted at high density with a narrow gap on a printed board. SOLUTION: A cylindrical part 14 is formed at the lower part of the approximately middle portion of a horizontal jig body 12 of a replacement jig 11 generated by pressing a thin plate of stainless steel, etc., and the mounting space for microchip parts 2 on a printed wiring board 1 is covered with the cylindrical part 14. With the upper part of the microchip parts 2 adjacent in the vicinity covered with the jig body 12, a hot blast is blown into the cylindrical part 14 so that only the solder in the mounting space is partially heated.
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