| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus for processing many substrates one after another whereby the process quality control effectively adapted to a many-model and small-amount production can be performed. SOLUTION: The substrate processing apparatus for applying specified processes to a plurality of semiconductor wafers W one after another comprises an wafer ID reader 5 for reading a substrate's ID designated to each semiconductor wafer W, substrate processing unit means 3, 10, 11, 15 for processing the semiconductor wafers W, based on specified processing conditions, an inspecting range setting unit 46 for previously storing the wafer W inspecting range for inspecting the processing result by the substrate processing units in relation to the wafer ID, and substrate inspecting units 9, 12, 16 for taking out the inspecting range stored by the inspecting range setting unit 46, based on the wafer ID read by the wafer ID reader 5 and inspecting the wafer W about its inspecting range.
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