| 摘要 |
PROBLEM TO BE SOLVED: To contrive a reduction in the thickness of a semiconductor device and a reduction in the cost of the device using an existing wire-bonding equipment. SOLUTION: A semiconductor device is provided with a plurality of inner leads 1b extendedly provided on the periphery of a semiconductor chip 2, a chip support part 5a supporting the chip 2 and a flange-shaped bonded part 5b formed on the periphery of the part 5a integrally with this part 5a, the part 5b consists of a thin plate member 5 bonded to the inner leads 1b, wires 4 connecting electrically pads 2a on the chip 2 with the inner leads 1b, a sealing part 3 formed by resin-sealing the chip 2 and a plurality of outer leads 1c and the support part 5a is arranged separately further from a ceiling surface 3a of the part 3 than the part 5b. Hereby, a staggered pad bonding in the thin semiconductor device can be made possible and at the same time, the wires 4 can be prevented from being exposed from the ceiling surface 3a of the part 3. |
