| 摘要 |
PROBLEM TO BE SOLVED: To raise a precision in plate height when a via hole case is filled with a plate metal by an electric plating. SOLUTION: Via holes 14 and 15 formed in an insulating layer 11 are filled with a plate metal 40 by electric plating. Here, a detection electrode 13 is formed at an opening edge of the via hole 15. At deposition of the plate metal 40 in the via holes 14 and 15 by the electric plating, the tip of the plate metal 40 contacts the detection electrode 13 as it reaches the opening edge of the via hole 15. As the electric resistance between a copper foil 12 and the detection electrode 13 abruptly changes, it is electrically detected for controlling terminating operation of electric plating, etc.
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