发明名称 REPAIRING DEVICE FOR CIRCUIT BOARD OR THE LIKE
摘要 PROBLEM TO BE SOLVED: To provide a smaller repairing device by utilizing a factory air. SOLUTION: Related to a repairing device for melting a solder of a circuit board, etc., in combination with a hot-air type solder melting device, two outside air introduction ports are separately provided. An air feeding line to a solder melting device 1 which communicates with a first air introduction port 17 is provided while an ejector 25 which communicates with a second air introduction port 23 is provided.
申请公布号 JP2001168522(A) 申请公布日期 2001.06.22
申请号 JP19990346695 申请日期 1999.12.06
申请人 HAKKO KK 发明人 YOKOYAMA TETSUO
分类号 B23K1/018;B23K3/02;B23K3/04;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/018
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