发明名称 LAMINATED CHIP PARTS AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide laminated chip parts with high dimensional accuracy that are suitable for high productivity and can cope with bulk chip mounting, and the manufacturing method of the same. SOLUTION: In laminated chip parts equipped with a chip-shaped laminate 12 having a coil-like internal conductor 10 formed by multilayered conductive patterns and a laminated chip part having an external electrode connected electrically to the end of the coil-like internal conductor 10, external electrodes 14 are so formed as to cover the circumferences of small-sized layers 12a provided in both ends of the chip-shaped laminate 12.
申请公布号 JP2001167929(A) 申请公布日期 2001.06.22
申请号 JP19990348621 申请日期 1999.12.08
申请人 KOA CORP 发明人 MORIKANE KEIICHI;KAMIKANE FUJITARO
分类号 H01F41/04;H01F17/00;H01F27/29;(IPC1-7):H01F17/00 主分类号 H01F41/04
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