发明名称 |
LAMINATED CHIP PARTS AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide laminated chip parts with high dimensional accuracy that are suitable for high productivity and can cope with bulk chip mounting, and the manufacturing method of the same. SOLUTION: In laminated chip parts equipped with a chip-shaped laminate 12 having a coil-like internal conductor 10 formed by multilayered conductive patterns and a laminated chip part having an external electrode connected electrically to the end of the coil-like internal conductor 10, external electrodes 14 are so formed as to cover the circumferences of small-sized layers 12a provided in both ends of the chip-shaped laminate 12.
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申请公布号 |
JP2001167929(A) |
申请公布日期 |
2001.06.22 |
申请号 |
JP19990348621 |
申请日期 |
1999.12.08 |
申请人 |
KOA CORP |
发明人 |
MORIKANE KEIICHI;KAMIKANE FUJITARO |
分类号 |
H01F41/04;H01F17/00;H01F27/29;(IPC1-7):H01F17/00 |
主分类号 |
H01F41/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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