| 摘要 |
PROBLEM TO BE SOLVED: To obtain a gold alloy wire with which the height of a bonding loop can be reduced furthermore keeping high purity of the gold and high strength and which can be employed as the bonding wire for a thin package device. SOLUTION: High purity gold is added with 5-50 ppm of calcium, 3-50 ppm of yttrium, 3-70 ppm or neodymium and/or praseodymium, and the remainder of inevitable impurities. |
