发明名称 COMPONENT MOUNTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To achieve the high speed of a component mounting apparatus by shortening the raising and lowering stroke of a plurality of suction nozzles when an electronic component is mounted. SOLUTION: A first raising and lowering member 27 is attached to a head body 26 so as to be freely raised and lowered by a first raising and lowering drive member 28. A second raising and lowering member 30 which is raised and lowered relatively to the first raising and lowering member 27 by a second raising and lowering drive member 29 attached to the first raising and lowering member 27 is installed. The plurality of suction nozzles 12 are attached to the first raising and lowering member 27. A plurality of selection members which energize the respective suction nozzles 12 selectively downward so as to correspond to the respective suction nozzles 12 are installed at the second raising and lowering member.
申请公布号 JP2001168590(A) 申请公布日期 2001.06.22
申请号 JP19990345789 申请日期 1999.12.06
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MUNEZANE TAKASHI;TANAKA KUNIO;NAGAYA TOSHIHIKO;KAWASUMI AKISUKE;MITSUSHIMA TAKATOSHI
分类号 H05K13/04;B25J15/06 主分类号 H05K13/04
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