发明名称 WIRING STRUCTURE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To realize a wiring structure wherein the wiring damage hardly happens and its manufacturing method. SOLUTION: Columnar protrusions 4 resulting from projected parts of a layer insulation film 2 are formed on the surface of the layer insulation film 2, and a wiring 3 is formed on the layer insulation film 2 so as to cover the columnar protrusions 4. Compared with a wiring formed on a flat layer insulation film, the contact area of the wiring 3 with the layer insulation film 2 is wide to increase the adhesion degree of both, resulting in that the wiring damage hardly happens. The columnar protrusions 4 function like posts against the wiring 3 and hence the wiring damage hardly happens.
申请公布号 JP2001168099(A) 申请公布日期 2001.06.22
申请号 JP19990354204 申请日期 1999.12.14
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAMURA KATSUHIKO
分类号 H01L21/3205;H01L21/768;H01L23/52;H01L23/522;(IPC1-7):H01L21/320 主分类号 H01L21/3205
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