| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer printed wiring board which is reliable in soldering as well as in electrical continuity of inner and outer layers, where the inner layer comprises an all-layer IVH structure with conductive paste while the outermost layer comprises a laser via for high- density mounting. SOLUTION: An adhesive layer 8 is formed on a conductive pattern 2 for an inner layer and an insulating substrate 3 for an inner layer comprising a conductive hole packed with a conductive paste, on which an insulating resin is coated. This settles to form an insulating resin layer 4 and a non-through hole is formed by laser working. Then an IVH 5 which electrically connects inner and outer layers by metal-plating, etc., and a conductive pattern 6 for an outer layer is formed on a surface metal by screen printing and photolithography, thus manufacturing a multilayer printed wiring board 7 for high-density mounting. |
