发明名称 PRINTED WIRING BOARD WITH HEATING FUNCTION AND MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board having a heating function and a mounting method wherein no electronic part using an expensive and reliable material is required, the electronic parts with different heat capacity are collectively mounted, and reworking is easy. SOLUTION: A printed wiring board 11 comprises a plurality of layers and one of them incorporates a heating wire 12 of a heating member. The heating wire 12 is arranged over the entire region of the printed wiring board 11. The heating wire 12 is exposed outside through a terminal 12a provided at the end of the printed wiring board 11, electrically connected, outside, to a control part not shown in the figure. The control part controls supply/cut-off of current to the heating wire 12.
申请公布号 JP2001168518(A) 申请公布日期 2001.06.22
申请号 JP19990353069 申请日期 1999.12.13
申请人 SEIKO EPSON CORP 发明人 KONDO MANABU
分类号 H05K3/34;H05K1/02;(IPC1-7):H05K3/34 主分类号 H05K3/34
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