| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip bonder in which the efficiency of bonding can be enhanced by shortening the unit process time. SOLUTION: In the chip bonder for bonding a chip 3 to a substrate 1 through an ACF 8 (anisotropic conductive agent), an ACF transfer station 20 is provided with two mechanisms 21 for transferring the ACF to the substrate 1 by means of a transfer head 23 using an ACF tape and the arranging pitch of the transfer mechanisms 21 is made to match the pitch P of the parts to be transferred on the substrate 1 through a feed screw mechanism 26. Since the ACF 8 can be transferred simultaneously at a plurality of parts, total unit process times is shortened and the efficiency of bonding can be enhanced.
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