| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for covering the bar-like electrode of a surface- mounting chip component with a conductive metal. SOLUTION: This method for covering the electrode of the surface-mounting chip component comprises the steps of adhering a tape on the first side face of a work plate, shaking the electrode for holding the plate in guide holes of the plate by the first ends of the drop-in electrodes, preloading the second ends of the electrodes to the guide holes of the plate, holding the plate by a suction holder, dipping the second end of the electrode in a liquid-like conductive metallic trough, dipping once more the plate in the trough, to alter the shape of the first end of the electrode to alter the shape of the first end of the electrode, baking the second end of the electrode, adhering another tape to the second side face of the plate, removing the tape of the first end side of the electrode, preloading the first end of the electrode, holding the plate by the holder, dipping the first end of the electrode in the trough, baking the first end of the electrode and separating the tape.
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