| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method for manufacturing it, capable of being sufficiently corresponding to an increase in the chip area and manufactured in a mass production at a low cost. SOLUTION: This semiconductor device comprises a semiconductor element, formed in a columnar base or on the outer surface of a cylindrical base. The method for manufacturing the semiconductor device comprises the steps of generating the plasma of a substantially cylindrical shape, jointly having a central axis with that of the base to form the element in the base or on the outer surface of the base, and treating the outer surface of the base by using the plasma.
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