发明名称 HEATER IN PROCESS FOR SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To provide a heater with a minimum thermal loss in a process for a semiconductor, by using a reflective plate as a heat blocking means on the lower side of a wafer boat and preventing the heat from moving downward in a heating furnace. SOLUTION: A gas feeding pipe 23 for feeding a reactive gas to the inside of an inner tube 22 is provided on the lower side of an outer tube 21. A gas discharging opening 24 for discharging the gas of the furnace is provided on the other side of the outer tube 21. An elevator plate 25 is provided on the lower side of the outer tube 21, while a rotating axle 26 is projected on the upper side of the elevator plate 25. A wafer boat 27 is provided on the upper side of the rotating axle 26. The heat blocking means 30 for blocking the heat in the inner tube 22 from shifting downward is provided between the rotating axle 26 and the wafer boat 27. The heat blocking means 30 includes a sealed case, a plurality of reflective plates crosswise in the case, and a plurality of supporting pins for supporting and fixing the reflective plates.
申请公布号 JP2001168047(A) 申请公布日期 2001.06.22
申请号 JP20000283319 申请日期 2000.09.19
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 AN JAE-HYUCK;YANG CHANG-JIP;KIM TAE-CHUL;KAN KEN
分类号 C23C16/44;C23C16/46;C30B25/10;H01L21/205;H01L21/22;(IPC1-7):H01L21/205 主分类号 C23C16/44
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