RELEASE FILM FOR SEALING SEMICONDUCTOR ELEMENT AND METHOD OR SEALING SEMICONDUCTOR ELEMENT USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a release film for sealing a semiconductor whose release characteristics are excellent without deforming a semiconductor termal or a release film, and a method for sealing the semiconductor element for improving the manufacturing efficiency of the semiconductor using the release film. SOLUTION: This is a release film for sealing a semiconductor element constituted of a single layer or multi-layers containing thermoplastic resin in which the following conditions are fulfilled, and a method for sealing the semiconductor element using the release film. The above mentioned conditions are that the wet exponent of a surface layer is 36 or less (1), a heat shrinkage ratio in 175 deg.C is 3% or less (2), elasticity in 175 deg.C is 10 to 500 MPa (3), and the thickness of the release film is 10 to 300μm (4).