发明名称 HEAT SINK
摘要 PROBLEM TO BE SOLVED: To obtain a heat sink which can efficiently dissipate heat generated in a body to be cooled. SOLUTION: This heat sink is something to do with the enhancement of the performance of the heat sink and is provided with a heat sink base addition member 8, which is secured in the interior of a heat sink base 1 or on the surface of the heat sink 1 and is constituted of a material of a heat conductivity better than that of the above heat sink base 1 and a fan 4. As a result, the substantial cooling performance of the heat sink to heat, which is generated in a body 7 to be cooled, is enhanced and the cooling performance is remarkably raised at equal capacity.
申请公布号 JP2001168247(A) 申请公布日期 2001.06.22
申请号 JP19990349715 申请日期 1999.12.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 TANAKA SHIGEYUKI;KASHIBA YOSHIHIRO;KAGA KUNIHIKO;CHIBA HIROSHI
分类号 H05K7/20;H01L23/36;H01L23/467;(IPC1-7):H01L23/36 主分类号 H05K7/20
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