| 摘要 |
In an optical pickup device employing a high-frequency superposition method, a high-frequency superposition circuit is mounted on an FPC. With this arrangement, the number of steps for attaching printed boards may be reduced and improvements in workability of assembly achieved. By electrically connecting a conductive plated surface that is conductive with a GND pattern formed on a projecting portion of the FPC with a conductive plated surface of a reinforcing plate, the GND pattern may be connected to a wide GND at a short distance, and actions of restricting extraneous emission may be improved.
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