发明名称 |
DAMPING THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLES |
摘要 |
A damping thermoplastic resin composition which comprises (a) 50 to 90 wt% of a noncrystalline thermoplastic resin (A) having a loss tangent (tan delta ) of 0.01 to 0.04 and a deflection temperature under load of 120 DEG C or above and (b) 50 to 10 wt% of a methyl methacrylate resin (B) and gives molded articles having the following physical properties (1) to (4); and articles molded from the composition: (1) a loss factor of 0.04 to 0.08, (2) a water absorption of 0.30 wt% or below, (3) a specific gravity of 1.05 to 1.3, (4) and a deflection temperature under load of 110 to 170 DEG C. This invention provides lightweight thermoplastic resin compositions and molded articles which are excellent in damping properties, dimensional accuracy, rigidity and heat resistance.
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申请公布号 |
WO0144372(A1) |
申请公布日期 |
2001.06.21 |
申请号 |
WO2000JP08668 |
申请日期 |
2000.12.07 |
申请人 |
TEIJIN CHEMICALS, LTD.;SONY CORPORATION;OGASAWARA, SATOSHI;ARAKAWA, NOBUYUKI |
发明人 |
OGASAWARA, SATOSHI;ARAKAWA, NOBUYUKI |
分类号 |
C08L69/00;C08L101/00;(IPC1-7):C08L101/00;C08L33/12;C08K3/04 |
主分类号 |
C08L69/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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