| 摘要 |
An epoxy resin composition that can be used for semiconductor encapsulation, laminated boards, coatings, castings, adhesives, electrically insulating materials and the like, because it has excellent workability and its cured product has excellent heat resistance and water resistance. Said epoxy resin composition comprises an epoxy resin (component A) having at least two epoxy groups in one molecule, and an alkenyl phenolic resin (component B) containing 50-99 % by weight of a polyalkenyl-substituted polyphenol compound represented by formula (1) and 1-50 % by weight of a dialkenyl-substituted bifunctional phenol compound.
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