HIGH DENSITY, HIGH FREQUENCY MEMORY CHIP MODULES HAVING THERMAL MANAGEMENT STRUCTURES

摘要

The present invention features an ultra high density, three-dimensional electronic circuit package suitable for constructing high capacity, high speed computer memory cards and the like. A demountable contact system allows easy test and/or burn-in. A memory card (20) has a number of electrical receptacles adapted to receive a daughter card (16). The daughter card (16) has memory devices (14 and 18) attached to it and a corresponding number of electrical connectors placed along at least one edge, adapted to detachably mate with the electrical receptacles of the memory card. The demountable connectors allow easy rework of the module before optional, permanent solder attach. Bare dies (14 and 18) or thin packages are mounted onto daughter cards (16), which in turn are mounted onto either a mother board or memory card (20) using pin/hole technology.