| 发明名称 |
RESIN SEALING MOLD AND RESIN SEALING METHOD |
| 摘要 |
A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).
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| 申请公布号 |
WO0143942(A1) |
申请公布日期 |
2001.06.21 |
| 申请号 |
WO2000JP08842 |
申请日期 |
2000.12.14 |
| 申请人 |
DAI-ICHI SEIKO CO., LTD.;OGATA, KENJI;NISHIGUCHI, MASASHI;MITSUI, YOSHIHIRO |
发明人 |
OGATA, KENJI;NISHIGUCHI, MASASHI;MITSUI, YOSHIHIRO |
| 分类号 |
B29C45/14;B29C45/16;B29C45/26;B29C45/56;B29C45/76;B29C45/82;(IPC1-7):B29C45/26 |
主分类号 |
B29C45/14 |
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