IC DEVICE HAVING OUTPUT TERMINAL RINGING COMPENSATION CIRCUIT

摘要

PURPOSE: An IC device having an output terminal ringing compensation circuit is provided to form a high-speed IC device by reducing a ringing phenomenon of a high impedance output terminal. CONSTITUTION: An IC device is formed with a bonding pad connected with a high impedance current output terminal, a lead frame connected with an external circuit by a bonding wire and the bonding pad, and a compensation circuit. The lead frame is packaged by an insulating material. The compensation circuit is used for minimizing a ringing signal generated by the bonding wire, the lead frame, and the insulating material. The compensation circuit is formed by combining directly a resistance, a capacitor, and an inductor to each other. The inductor, the resistance, and the capacitor are connected between an internal node and a ground between the high impedance current output terminal and the bonding pad.