| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device whose one side is sealed up with resin and which is lessened in thickness and size and kept free from troubles such as delaminatation of resin or the fall of leads. SOLUTION: A semiconductor device is composed of a semiconductor chip mount 1, a semiconductor chip 2 mounted on the mount 1, leads 4 provided around the mount 1, and bonding wires 6 which electrically connect the semiconductor chip 1 to the leads 4, and the device is sealed up with resin keeping the undersurfaces of the leads 4 exposed, where the leads 4 are partially lessened in thickness excluding their tips 4a, and the semiconductor device is subjected to resin sealing making the thinned parts 5 of the surfaces of the leads 4 face downward. |
