CONDUCTIVE RESIN, ELECTRONIC MODULE USING CONDUCTIVE RESIN, AND METHOD OF MANUFACTURING ELECTRONIC MODULE

摘要

To mount an electronic device, a conductive resin containing a specific diluent is used, or a specific diluent is applied before conductive resin cures. In this way, the electrodes (5) of an electronic device (4) are connected with the corresponding electrodes (2) of a circuit board (1) by resin (3a) with a base of conductive filler, while the bottom of the electronic device (4) is connected to the borders of the electrodes (5) by resin (3b, 3c) consisting chiefly of the binder resin originating from the conductive resin. The binder-base resin (3b, 3c) increases the strength of the connections.