发明名称 |
Micro-via-multilayer reconditioning method using laser technology |
摘要 |
A method for exposing a layer of a multi-layer module, in which a conductor path positioned internally is exposed by removal of basic material by means of laser action. The module is formed with a FR4-standard multilayer, and at least one micro-via-additional layer mounted on the multilayer.
|
申请公布号 |
DE19960292(A1) |
申请公布日期 |
2001.06.21 |
申请号 |
DE19991060292 |
申请日期 |
1999.12.14 |
申请人 |
SIEMENS AG |
发明人 |
KATZIER, HELMUT;GOLDBERG, MARTIN |
分类号 |
H05K3/00;H05K3/22;H05K3/46;(IPC1-7):H05K3/46;B23K26/00 |
主分类号 |
H05K3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|