发明名称 Film forming apparatus
摘要 A discharge nozzle in a film forming apparatus of the present invention includes a substantially cylindrical support member and a thin plate or a thin plate portion supported on a face on a substrate side of the support member and closing the face on the substrate side, and a discharge port for discharging a coating solution is provided in the thin plate or the thin plate portion. It is possible to form a smaller discharge port in the thin plate or the thin plate portion by laser processing, punching, or the like than that obtainable by conventional injection molding processing. An amount of discharge and a discharge area on the substrate of the coating solution can be controlled more precisely. The film forming apparatus of the present invention includes a cleaning device for cleaning the discharge nozzle which includes a cleaning solution jet port for jetting a cleaning solution for cleaning to the discharge port of the discharge nozzle and a suction port for sucking an atmosphere in the vicinity of the discharge port. Contaminants adhering to the discharge port are removed more completely than before. Accordingly, the cleaning can be conducted effectively even if the diameter of the discharge port is very small. The suction port can suck and drain properly the cleaning solution jetted to the discharge port, preventing scatter of the cleaning solution and contamination around the discharge port.
申请公布号 US2001003966(A1) 申请公布日期 2001.06.21
申请号 US20000735902 申请日期 2000.12.14
申请人 TOKYO ELECTRON LIMITED 发明人 KITANO TAKAHIRO;MORIKAWA MASATERU;ESAKI YUKIHIKO;ISHIZAKA NOBUKAZU;KOGA NORIHISA;TAKESHITA KAZUHIRO;OOKUMA HIROFUMI;AKIMOTO MASAMI
分类号 H01L21/027;H01L21/00;(IPC1-7):B05C11/00;B05C13/00;B05C13/02 主分类号 H01L21/027
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