| 摘要 |
Interconnection between semiconductor chip (3) and antenna (5) in thermoplastics body is made via connecting wires (7) and/or additional components such as capacitors. Thermoplastic body is single piece of thermoplastic film (1). Semiconductor chip and additional components are placed completely within cavity (8) preformed in film. Antenna and connecting wires are pressed into thermoplastic film. Electrically insulating varnish is applied to electrically conductive components (3,4). Cavity is created by milling or thermoplast-ablation using laser. An Independent claim is included for a contactless transponder. |
