SURFACE-TREATED COPPER FOIL AND METHOD FOR MANUFACTURING THE SURFACE-TREATED COPPER FOIL

摘要

A copper foil used for manufacturing a printed wiring board and exhibiting an effect of drawing out as much as possible the performance of a silane-coupling agent used for enhancing the adhesion between the copper foil and the board and a method for manufacturing the same are disclosed. A zinc or zinc-alloy layer is formed on the copper foil as a rust prevention treatment. An electrolytic chromate layer is formed on the zinc or zinc-alloy layer. The surface of the electrolytic chromate layer is roughed and dried. A silane-coupling agent adsorbing layer is formed on the electrolytic chromate layer and dried, thus manufacturing a surface-treated copper foil for printed wiring boards.