HIGH DENSITY, HIGH FREQUENCY LINEAR AND AREA ARRAY ELECTRICAL CONNECTORS

摘要

Electrical connections are made between daughter cards and mother boards and between a chip carrier and an interposer (16) by using receptacle holes (24) or Plated Through Holes (PTH) structures in the mother board itself or the interposer (16). Fingers (22a) protrude from the contact pad and serves as a bending protrusions of spring like contact element. The metal layer of the flanges can be either built up by well known additive or subtractive PCB fabrication technique, or formed or stamped separately, then laminated. The connectors can be fabricated in sparsely or fully populated linear or area arrays.