发明名称 |
Electronic devices including micromechanical switches |
摘要 |
A method of manufacturing an electronic device comprising an integrated circuit device having micromechanical switches (10) and thin film circuit components (20) provided on a common substrate (2). The micromechanical switches (10) have contact beams (12) extending over a respective sacrificial region. Component layers (5) for forming the thin film circuit components are used as the sacrificial region in the area of the substrate allocated to the micromechanical switches . This enables various layers to be shared between the switches and the components. A supplementary support layer (50) may be provided for the contact beams to protect them against damage during subsequent processing and fabrication stages. A portion of this support layer can be left attached to the beam in the completed device for increased strength.
|
申请公布号 |
US2001004548(A1) |
申请公布日期 |
2001.06.21 |
申请号 |
US20000734077 |
申请日期 |
2000.12.11 |
申请人 |
U.S. PHILIPS CORPORATION |
发明人 |
FRENCH IAN D. |
分类号 |
G01T1/20;B81B3/00;B81C1/00;H01H1/00;H01H59/00;H01H67/22;H01L27/14;H01L27/146;H01L31/10;H04N5/32;H04N5/335;(IPC1-7):H01L21/320 |
主分类号 |
G01T1/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|