发明名称 Semiconductor device and its manufacturing method capable of reducing low frequency noise
摘要 <p>In a semiconductor device, a first semiconductor layer (2) is formed on a semiconductor substrate (1). A second semiconductor layer (3) is formed on a part of the first semiconductor layer, and a third semiconductor layer (4) is formed on a part of the second semiconductor layer. A first electrode (5) is formed on the third semiconductor layer, and a second electrode (6) is formed on the first semiconductor layer in contact with the second semiconductor layer and apart from the semiconductor layer, thus forming a diode. &lt;IMAGE&gt;</p>
申请公布号 EP1109226(A2) 申请公布日期 2001.06.20
申请号 EP20000250435 申请日期 2000.12.14
申请人 NEC ELECTRONICS CORPORATION 发明人 MIZUTANI, HIROSHI
分类号 H01L21/8222;H01L21/76;H01L21/329;H01L21/338;H01L21/822;H01L21/8232;H01L21/8248;H01L21/8252;H01L27/04;H01L27/06;H01L27/095;H01L29/737;H01L29/778;H01L29/812;H01L29/872;(IPC1-7):H01L29/872;H01L29/868;H01L29/88 主分类号 H01L21/8222
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