发明名称 |
Semiconductor device and its manufacturing method capable of reducing low frequency noise |
摘要 |
<p>In a semiconductor device, a first semiconductor layer (2) is formed on a semiconductor substrate (1). A second semiconductor layer (3) is formed on a part of the first semiconductor layer, and a third semiconductor layer (4) is formed on a part of the second semiconductor layer. A first electrode (5) is formed on the third semiconductor layer, and a second electrode (6) is formed on the first semiconductor layer in contact with the second semiconductor layer and apart from the semiconductor layer, thus forming a diode. <IMAGE></p> |
申请公布号 |
EP1109226(A2) |
申请公布日期 |
2001.06.20 |
申请号 |
EP20000250435 |
申请日期 |
2000.12.14 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
MIZUTANI, HIROSHI |
分类号 |
H01L21/8222;H01L21/76;H01L21/329;H01L21/338;H01L21/822;H01L21/8232;H01L21/8248;H01L21/8252;H01L27/04;H01L27/06;H01L27/095;H01L29/737;H01L29/778;H01L29/812;H01L29/872;(IPC1-7):H01L29/872;H01L29/868;H01L29/88 |
主分类号 |
H01L21/8222 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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