发明名称 |
Arrangement and method for treatment of a disc-like substrate |
摘要 |
An apparatus for processing a substrate wafer wherein the apparatus includes a reaction chamber, a wafer holder intended to hold the substrate wafer, and a susceptor. A temperature sensor, preferably a thermocouple with two junctions, is provided for measuring the difference between the temperatures at the site of the susceptor and at a site between the susceptor and the substrate wafer. |
申请公布号 |
EP0874388(A3) |
申请公布日期 |
2001.06.20 |
申请号 |
EP19980103016 |
申请日期 |
1998.02.20 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
KERSCH, ALFRED, DR.;SCHAFBAUER, THOMAS |
分类号 |
G01K7/02;G01K7/04;H01L21/00;H01L21/205;H01L21/26;H01L21/324 |
主分类号 |
G01K7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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