发明名称 Method for the formation of semiconductor layer
摘要 <p>A method for the formation of a semiconductor layer by which a defect density of structural defects, particularly a dislocation density of threading dislocations in the resulting semiconductor layer can be remarkably reduced, so that hours of work can be shortened as well as a manufacturing cost can be reduced without requiring any complicated process comprises supplying a structural defect suppressing material for suppressing structural defects in the semiconductor layer onto a surface of the layer of a material from which the semiconductor layer is to be formed. &lt;IMAGE&gt; &lt;IMAGE&gt; &lt;IMAGE&gt; &lt;IMAGE&gt;</p>
申请公布号 EP1109208(A2) 申请公布日期 2001.06.20
申请号 EP20000127381 申请日期 2000.12.13
申请人 RIKEN 发明人 TANAKA, SATORU;TAKEUCHI, MISAICHI;AOYAGI, YOSHINOBU
分类号 H01L21/205;C30B25/02;H01L21/20;H01L21/203;H01L33/12;H01L33/16;H01L33/32;H01L33/34;H01S5/323;H01S5/343;(IPC1-7):H01L21/20;C30B25/18 主分类号 H01L21/205
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