发明名称 Method for manufacturing paste for electroconductive thick film,paste for electroconductive thick film and laminated ceramic electronic part
摘要 There is disclosed a method for manufacturing a paste for electroconductive thick film using a solid component, a diluting solvent, a dispersant, an organic resin component, and a main solvent, wherein the boiling point of the diluting solvent is lower than that of the main solvent by about 100° C. or more, and the diluting solvent is compatible with the organic resin component and the main solvent, the method comprising a first dispersion step for obtaining a first slurry by subjecting to a dispersion treatment, a first mill base prepared through mixing the solid component, the diluting solvent and the dispersant, a second dispersion step for obtaining a second slurry by subjecting to a dispersion treatment, a second mill base prepared through mixing the first slurry with the organic resin component and the main solvent, and a step for removing the diluting solvent from the second slurry.
申请公布号 GB2351678(B) 申请公布日期 2001.06.20
申请号 GB20000013559 申请日期 2000.06.02
申请人 * MURATA MANUFACTURING CO. LTD. 发明人 MOTOHIRO * SHIMIZU;ATSUYOSHI * MAEDA;HISASHI * MIKI
分类号 C09D5/24;B22F1/00;B22F3/22;B22F5/00;C09D201/00;H01B1/20;H01B1/22;H01B13/00;H01G4/008;H01L23/498;H05K1/09;(IPC1-7):B01F3/12 主分类号 C09D5/24
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