发明名称 |
THERMAL HEAD, THERMAL HEAD UNIT, AND METHOD OF MANUFACTURE THEREOF |
摘要 |
<p>The productivity of a board forming process is improved, the handling ability during a mounting process is enhanced, and the cost is remarkably reduced. In a thermal head (10) having a head chip 20 having one surface on which heating elements (24) and electrodes (25) connected to the heating elements (24) are provided, and a semiconductor integrated circuit (32) connected to the electrodes (24), a wiring substrate (30) is provided, which is joined to the other surface of the head chip (20), and the semiconductor integrated circuit 32 is mounted to the wiring substrate (30). <IMAGE></p> |
申请公布号 |
EP1108552(A1) |
申请公布日期 |
2001.06.20 |
申请号 |
EP19990937006 |
申请日期 |
1999.08.09 |
申请人 |
SEIKO INSTRUMENTS INC. |
发明人 |
TAKIZAWA, OSAMU;SAMBONGI, NORIMITSU;SHOJI, NORIYOSHI;NAKAMURA, YUJI;ITO, TARO;YAMAGUCHI, YUMIKO |
分类号 |
B41J2/335;B41J2/345;(IPC1-7):B41J2/335 |
主分类号 |
B41J2/335 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|