THERMOSETTING ADHESIVE MATERIAL

摘要

PROBLEM TO BE SOLVED: To enable blending an insulating inorganic filler with a thermosetting adhesive material for connecting terminals installed at each opposing surface of opposing pair of base plates each other without reducing its toughness parameter. SOLUTION: This thermosetting adhesive material for connecting terminals installed at each opposing surface of the opposing pair of base plates each other and containing the thermosetting resin and the inorganic filler is characterized by that the blended amount of the insulating inorganic filler [a (vol.%)] and the elastic modulus of the thermosetting adhesive material after curing [E(GPa)/30 deg.C] satisfy the following relative formula (1): 0.042a+0.9<E<0.106a+2.5, and that at the same time, the blended amount of the insulating inorganic filler [a (vol.%)] and the tensile elongation rate [d(%)] of the thermosetting adhesive material at 25 deg.C after its curing satisfy the following relative formula (2): -0.072a+4<d<-0.263a+1.