发明名称 |
Heat sink with offset fin profile |
摘要 |
The present invention provides for a heat sink that, in a particularly advantageous embodiment, includes a heat sink body with a spine configured to be oriented parallel with the direction of air flow when the heat sink is coupled to a substrate. The heat sink further includes a first set of cooling fins that are coupled to and extend from the spine along a first common longitudinal axis. At least two of the first set of cooling fins laterally extend from the first common longitudinal axis in a common direction and in an offset relationship to each other.
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申请公布号 |
US6249437(B1) |
申请公布日期 |
2001.06.19 |
申请号 |
US19990419174 |
申请日期 |
1999.10.15 |
申请人 |
TYCO ELECTRONICS LOGISTICS AG |
发明人 |
FERRANTI STEPHEN A.;MELLO JOHN PAUL;GANESA-PILLAI MADHU;REEVES AMANDA C.;KLAFTER LEON;ZHANG JOANNE C. |
分类号 |
H01L23/367;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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