发明名称 Heat sink with offset fin profile
摘要 The present invention provides for a heat sink that, in a particularly advantageous embodiment, includes a heat sink body with a spine configured to be oriented parallel with the direction of air flow when the heat sink is coupled to a substrate. The heat sink further includes a first set of cooling fins that are coupled to and extend from the spine along a first common longitudinal axis. At least two of the first set of cooling fins laterally extend from the first common longitudinal axis in a common direction and in an offset relationship to each other.
申请公布号 US6249437(B1) 申请公布日期 2001.06.19
申请号 US19990419174 申请日期 1999.10.15
申请人 TYCO ELECTRONICS LOGISTICS AG 发明人 FERRANTI STEPHEN A.;MELLO JOHN PAUL;GANESA-PILLAI MADHU;REEVES AMANDA C.;KLAFTER LEON;ZHANG JOANNE C.
分类号 H01L23/367;(IPC1-7):H05K7/20 主分类号 H01L23/367
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