| 摘要 |
PROBLEM TO BE SOLVED: To prevent a semiconductor wafer from becoming a tapered shape and to improve the flatness of the semiconductor wafer. SOLUTION: Concerning a polishing condition, each number of revolutions of a sun gear 3, an internal gear 4, an upper surface plate 5 and a lower surface plate 6 is decided so as to fix the rotating direction of a semiconductor wafer 1, or each number of revolutions of the sun gear 3, the internal gear 4, the upper surface plate 5 and the low surface plate 6 is decided so as to fix a rotation moment direction applied on the semiconductor wafer 1. |
