| 摘要 |
PROBLEM TO BE SOLVED: To provide a double-sided polishing template and a double-side polishing method using the double-sided polishing template, without causing thickness of an outer peripheral portion of a polished semiconductor wafer thin compared with the thickness of a center portion, and capable of manufacturing the semiconductor wafer having high flatness. SOLUTION: This double-sided polishing template has a template main body 4 composed of an elastic element 2, and two plane-shaped inelastic elements 3a, 3b. The template main body 4 has the thickness TP1 which is thicker than the thickness TW1 of a plane shaped article W to be polished when not polished, and same as the thickness of the article W to be polished when polishing. The template main body 4 also has a storing hole 5 for loading article W to be polished. |
